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  page 1 formosa ms fm301-bs thru fm307-bs http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121143 2013/12/20 2015/10/12 b 7 chip general purpose rectifiers 1 2 2 2 2 3 4 4 4 5 6 6 7 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings and ................................. rating and characteristic curves........................................................ pinning information........................................................................... marking........................................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... electrical characteristics mechanical data...............................................................................
page 2 *1 repetitive peak reverse voltage *2 rms voltage *3 continuous reverse voltage *4 maximum forward voltage@i =3.0a f parameter conditions forward rectified current forward surge current reverse current diode junction capacitance storage temperature see fig.2 8.3ms single half sine-wave (jedec methode) f=1mhz and applied 4v dc reverse voltage symbol min. typ. max. unit i o i fsm i r c j t stg a a a o c pf 3.0 100 5.0 +175 -55 v = v t = 25 c r rrm j o v = v t = 125 c r rrm j o 40 250 formosa ms batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. low profile surface mounted application in order to optimize board space. high current capability lead-free parts meet environmental standards of mil-std-19500 /228 features . high surge capability. glass passivated chip junction. ? suffix "-h" indicates halogen-free parts, ex. fm301-bs-h. ? ? ? ? ? ? fm301-bs FM302-BS fm303-bs 35 70 140 50 100 200 symbols v rrm (v) v rms v r (v) (v) *1 *2 *3 v f (v) *4 fm304-bs fm305-bs 280 420 400 600 1.10 -55 to +150 fm306-bs fm307-bs 800 1000 560 700 50 100 200 400 600 800 1000 3.0a surface mount general purpose rectifiers - 50v-1000v (c) o operating temperature t, j http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. maximum ratings and electrical characteristics (at t =25 a o c unless otherwise noted) chip general purpose rectifiers fm301-bs thru fm307-bs package outline dimensions in inches and (millimeters) smb-s 0.220(5.6) 0.205(5.2) 0.020(0.5) typ. 0.138(3.5) 0.122(3.1) 0.075(1.9) 0.083(2.1) 0.067(1.7) 0.060(1.5) 0.040 (1.0) typ. 0.040(1.0) typ. mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : 0.072 gram ? ? ? ? ? ? do-214aa / smb-s approximated thermal resistance r ja o c/w 34 junction to ambient junction to case 20 r jc ds-121143 2013/12/20 2015/10/12 b 7
page 3 rating and characteristic curves (fm301-bs thru fm307-bs) 0.1 1.0 .01 10 50 characteristics instantaneous for ward current ,(a) forward voltage,(v) pulse width 300us 1% duty cycle .6 .7 .8 .9 1.0 1.1 1.2 1.3 3.0 t =25 c j fig.2-typical forward current derating curve average for ward current ,(a) 0.5 1.0 1.5 2.0 2.5 3.0 fig.4-maximum non-repetitive forward surge current fig.5-typical junction capacitance reverse voltage,(v) junction cap acitance,(pf) 140 120 100 80 60 40 20 0 .01 .05 .1 .5 1 5 10 50 100 fig.1-typical forward 0 0 20 40 60 80 100 120 140 160 180 200 lead temperature,( c) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. 25 0 50 75 100 125 number of cycles at 60hz 110 5 50 100 t =25 c j 8.3ms single half sine wave jedec method peak for ward surge current ,(a) ds-121143 2013/12/20 2015/10/12 b 7 .1 1.0 10 100 fig.3 - typical reverse characteristics reverse leakage current , ( a)  percentage rated peak reverse voltage 0 20 40 60 80 100 120 140 .01 t =125 c j t =25 c j
pinning information pin1 cathode pin2 anode pin simplified outline symbol marking type number marking code suggested solder pad layout dimensions in inches and (millimeters) a c b page 4 1 2 formosa ms fm301-bs a31 FM302-BS a32 fm303-bs a33 fm304-bs a34 fm305-bs a35 fm306-bs a36 fm307-bs a37 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip general purpose rectifiers fm301-bs thru fm307-bs 1 2 b 0.059 (1.50) a 0.078 (2.00) c 0.110 (2.80) package smb-s ds-121143 2013/12/20 2015/10/12 b 7
page 5 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip general purpose rectifiers fm301-bs thru fm307-bs packing information item tolerance smb-s carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 3.81 5.74 2.24 ds-121143 2013/12/20 2015/10/12 b 7
page 6 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip general purpose rectifiers fm301-bs thru fm307-bs reel packing smb-s 4,000 8.0 8,000 335*335*38 330 382*356*392 88,000 17.0 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 13" 1.storage environment: temperature=5 ~40 humidity=55% 25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 10~30sec 3.reflow soldering critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-121143 2013/12/20 2015/10/12 b 7
page 7 formosa ms http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. chip general purpose rectifiers fm301-bs thru fm307-bs 1. solder resistance 2. solderability 3. high temperature reverse bias 4. forward operation life 5. intermittent operation life 6. pressure cooker 7. temperature cycling 8. forward surge 9. humidity 10. high temperature storage life at 260 5 for 10 2sec. at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. rated average rectifier current at t =25 for 500hrs. t = 25 c, i = i on state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c c cc c c o o o o o oo o o rj a afo sig a a o mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 mil-std-750d method-1027 mil-std-750d method-1036 mil-std-750d method-1051 mil-std-750d method-4066-2 mil-std-750d method-1021 mil-std-750d method-1031 jesd22-a102 item test conditions reference high reliability test capabilities ds-121143 2013/12/20 2015/10/12 b 7


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